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Die Bonding Paste
Large line-up of 'EPINAL' are used in the fabrication of a viriety of electronic components.
Epoxy Molding Compounds
The CEL series which are used for the encapsulation of chips is constructed from Hitachi Chemical's exclusive accelerated hardening agent, impurity-free epoxy resin, filler and hardener. To complement the individual type of semiconductor devices to be treated, an extensive selection of different products and environmental friendly epoxy molding compound are also available.
High Voltage Diodes
Versatile line up of power diodes including high reliability glass types, surge suppression devices to protect electronic equipment (especially in automotive applications) and high voltage types for display operation at high frequencies. Axial lead, press-fit and surface mount packages available.
High Voltage IC
High voltage monolithic power ICs, using unique dielectric latch up free structures. Single chip motor driver, gate driver and ultrasound imaging ICs for industrial, consumer and medical applications.
Insulated Gate Bipolar Transistors (IGBT)
High voltage, high power IGBT modules 1.7kV, 3.3kV, 4.5kV & 6.5kV, up to 2400A. High thermal fatigue durability, high speed and low loss. Packages include European standard types.